Surface Mount Device Package Types

As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases. Surface mount device package types. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame.

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A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case.

Surface mount device package types.

Surface mount device package types soic package. Sot 223 small outline transistor. Micro surface mount device extended technology. Bump chip carrier bga.

Ceramic pin grid array cpga graphic cqfp. It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. Ceramic flat pack clga. The small outline integrated circuit soic plastic package is shown above.

A very large number of different types of package exist. Concurrently as the device complexity increases the heat generated by operation. The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. Bumpered quad flat pack cabga ssbga.

A surface mount package is favored where a low profile package is required or the space available to mount the package is limited. Ceramic land grid array see lga cpga. Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process. There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below.

Chip array small scale ball grid array cbga. Ceramic ball grid array cfp.

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